π The engineering department reviews the design files to ensure completeness and feasibility.
π Detailed manufacturing instructions are prepared for each PCB order, including modifications for optimal production.
π Production drawings and process cards are used to track and ensure the accuracy of each production process.
π¬ Each layer of the PCB is exposed to UV light to polymerize a dry film, protecting the copper surface during etching.
π οΈ The inner layer panels of the multi-layer PCBs go through the etching process to dissolve the exposed copper surface and create the desired trace.
π The inner layers are inspected for defects before going through the lamination process to stack and fix the core boards and pre-preg together.
The manufacturing process of multi-layer PCBs involves drilling holes in the copper foil and inspecting the board for any issues.
To connect circuits between different layers, a non-conductive epoxy resin and fiberglass board are used, followed by metallization through copper deposition.
The board undergoes various steps like deburring, alkaline cleaning, micro etching, and copper plating to ensure adhesion and conductivity.
π The multi-layer PCB manufacturing process involves various treatments and plating to ensure the conductivity and physical properties of the circuits.
π‘ Micro etching and acid pickling are used to remove oxide layers and maintain the stability of the plating tank during the plating process.
π Automatic Optical Inspection is conducted to check the etching quality and ensure that defects such as short circuits and copper residues are controlled.
π Automatic Optical Inspection (AOI) detects defects early and prevents defective boards.
ποΈ Screen printing is used to apply the soda mask layer and legend information on the board.
π Direct Legend Printing (DLP) offers higher printing accuracy and is suitable for small batches.
PCB manufacturing process includes board maintenance, ink colors, and legend requirements.
Surface finishes for PCB include HASL, OSP, and ENIG.
HASL process involves pre-treatment, flux coating, hot air leveling, and post cleaning.
PCB profiling can be done through routing or v-scoring methods.
π§ PCB manufacturing process includes v-scoring machine for easy separation of panels.
π Flying probe test is a convenient and safe method for testing circuit boards.
π Bed of nails test allows rapid testing of multiple points on circuit boards, but requires custom fixtures.
π Final quality control inspection ensures that printed circuit boards meet specifications before shipping.
π¦ PCBs are vacuum packed and labeled for transportation, protecting against moisture and collisions.
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